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| Clamping Force Distribution within Press Pack IGBTs |
| Deng Erping1, 2, Zhao Zhibin1, Zhang Peng2, Huang Yongzhang1, Lin Zhongkang2 |
1. State Key Laboratory of Alternate Electrical Power System with Renewable Energy Sources North China Electric Power University Beijing 102206 China;
2. State Grid Global Energy Interconnection Research Institute Changping District Beijing 102211 China |
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Abstract External clamping force is needed to keep all components of press pack IGBTs (PP IGBTs) both electrical and mechanical contact well, which is directly stacked together. It will introduce electrical and thermal contact resistances. Thus, the clamping force is an important parameter for the chip, because it influences electrical contact resistance, thermal contact resistance and power cycling reliability. The clamping force distribution within PP IGBTs is analyzed based on the finite element model and specific application conditions. The impacts of machining tolerance and internal layout of PP IGBTs are discussed. The test bench, including clamping fixture and FUJI prescale, is used to measure the clamping force distribution within PP IGBTs. The experimental results agree well with those using the finite element model. It can not only verify the correct of finite element model and boundary conditions, but also indicate that the external clamping also has a huge influence on the clamping force distribution within PP IGBTs.
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Received: 19 August 2016
Published: 29 March 2017
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2017, Vol. 32 
