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| Thermal Analysis of Driving-Unit for Ring-Type Traveling-Wave Ultrasonic Motor Based on MCM |
| Gu Juping1, 2, Hu Minqiang2, Jin Long2, Han Qunfei1, Wang Deming3, Wang Aijun1 |
| 1. Nantong University Nantong 226019 China 2. Southeast University Nanjing 210096 China 3. Nanjing University of Technology 210009 China |
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Abstract Based on the multi-chip module (MCM) technique, one integrated circuit unit driving for ring-type traveling-wave ultrasonic motor (RTWUSM) is designed in this paper. The 3-dimensional thermal analysis model used by finite element method (FEM) is also been built in this paper. The temperature distribution and radiating condition are calculated under air free convection, and then the quantitative analysis is made for the IC driving for RTUSM based on MCM technique under air forced convection. The results are the foundations for the IC driving of other motors.
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Received: 14 October 2008
Published: 12 December 2014
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2010, Vol. 25 
