Abstract:In order to reduce the size of filter and improve the power density of switch and power supplies, a passive integrated EMI filter structure based on planar stacked-type interleaved parallel connection is proposed in the paper. According to frequency range distributed rule of differential mode noise and common mode noise, film medium materials with higher stability of temperature is interleaved to realize the integration of common mode capacitance. In order to realize the integration of differential-mode capacitance, the Ⅱkind ceramic material X7R with higher stability of electric property is used. The PCB winding is used to realize the integration of common-mode inductor and differential mode the inductance. The equivalent circuits of common-mode and differential-mode in high-frequency modeling of this EMI filter are given, furthermore, the calculated formulas of insertion loss are deduced. The results of simulation and experiment verify the effectiveness of planar completely integrated EMI filter, and the correctness of the equivalent circuits of high frequency differential-mode, common-mode and the formulas of insertion loss.
杨玉岗, 那欣, 王长华, 冯本成. 基于积木式交错并联的平面全集成EMI滤波器[J]. 电工技术学报, 2012, 27(3): 181-187.
Yang Yugang, Na Xin, Wang Changhua, Feng Bencheng. Planar Completely Integrated EMI Filter Based on Stacked-Type Interleaved Connection. Transactions of China Electrotechnical Society, 2012, 27(3): 181-187.
[1] 温志伟. 基于柔性多层带材的集成EMI滤波器设计[D]. 杭州: 浙江大学, 2010.
[2] 钱照明, 陈恒林. 电力电子装置电磁兼容研究最新进展[J]. 电工技术学报, 2007, 22(7): 1-11.
Qian Zhaoming, Chen Hengli. State of art of electromagnetic compatibility research on power electronic equipment[J].Transactions of China Electrotechnical Society, 2007, 22(7): 1-11.
[3] 张林昌. 发展我国的电磁兼容事业[J]. 电工技术学报, 2005, 20(2), 23-28.
Zhang Linchang. Developing electromagnetic compatibility undertaking in our country [J]. Transactions of China Electrotechnical Society, 2005, 20(2): 23-28.
[4] 陈为, 何建农. 电力电子高频磁技术及其发展趋势[J]. 电工电能新技术, 1999, (2): 30-34.
Chen Wei, He Jiannong. Power electronics high-frequency magnetics technology and their development [J]. Advanced Technology of Electrical Engineering and Energy, 1999(2): 30-34.
[5] 钱照明, 张军明, 谢小高, 等. 电力电子系统集成研究进展与现状[J]. 电工技术学报, 2006, 21(3), 1-14.
[6] 陈恒林. EMI滤波器高频建模—寄生效应研究[D]. 杭州: 浙江大学, 2007.
[7] 张艳军. 高功率密度直流变流器及其无源元件集成研究[D]. 杭州: 浙江大学. 2008.
[8] 伍晓峰, 温志伟, 徐德鸿. 一种基于柔性多层带材绕组的集成滤波器结构[C]. 第三届中国高校电力电子与电力传动学术年会, 2009: 422-427.
[9] 黄河清. 电源EMI滤波器研究[D]. 西安: 西安电子科技大学, 2009.
[10] Lee Fred C, Xu Ming, Wang Shuo, et al. Design challenges for distributed power systems[J]. Asian Power Electronics Journal, 2007, 1(1): 1-14.
[11] Zhao Linying. Generalized frequency plane model of integrated electromagnetic power passives [D]. Blacksburg, Virginia, USA: The Virginia Polytechnic Institute and State University, 2004.
[12] Chen Ren Gang. Integrated EMI filter for switch mode power supplies[D]. Blacksburg, Virginia, USA: The Virginia Polytechnic Institute and State University, 2004.
[13] Jiang Yan. Three dimensional passive integrated electronic ballast for low wattage HID lamps [D]. Blacksburg, Virginia, USA: The Virginia Polytechnic Institute and State University, 2009.
[14] Biela J, Wirthmueller A, Waespe R, et al. Passive and active hybrid integrated EMI filters[J]. IEEE Transactions on Power Electronics, 2006, 24(5): 1340-1349.
[15] Wang Shuo. Characterization and cancellation of high-frequency parasitic for EMI filters and noise separators in power electronics applications[D]. Blacksburg, Virginia, USA: The Virginia Polytechnic Institute and State University, 2005.