基于亚胺键的香草醛基可降解环氧树脂综合性能研究

doi:10.19595/j.cnki.1000-6753.tces.240564

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Abstract

Bisphenol A-type epoxy resins are widely used in epoxy-insulated electrical equipment and other fields due to their excellent comprehensive performance, but due to the formation of permanent three-dimensional cross-linking network after curing of epoxy resins, a large number of electrical equipment can not be efficiently degraded and recycled after decommissioning, which results in a serious waste of resources. In this paper, vanillin is used as the raw material to prepare bio-based epoxy resin, and at the same time, dynamic imine bonding is introduced to prepare degradable vanillin-based glassy epoxy resin (EDV), and the traditional bisphenol A-based epoxy resin (DGEBA) and vanillin-based epoxy resin are blended with different ratios, and the high-performance, degradable and recycled epoxy resin copolymers are prepared, and the curing process is analyzed in detail, and the experiments are analyzed The basic service characteristics of the resin under different blending ratios in terms of electrical, thermal and mechanical properties, and its degradation and recycling properties were explored.
Firstly, in order to prepare vanillin-based epoxy resins based on imine bonding, vanillin and p-aminophenol were chosen as raw materials, and the syntheses were epoxidized and blended with conventional bisphenol A-type epoxy resins at different ratios, and MHHPA and EMIP were chosen as the curing agent and promoter, respectively, and were prepared in accordance with the curing mode of the probe, and at the same time, conventional bisphenol A-type epoxy resins were set up as the control group. Then, Fourier infrared spectroscopy tests were carried out and the results showed that the epoxy resin was correctly synthesized and fully cured. Finally, the data of different systems of epoxy resins were comparatively analyzed by thermogravimetric analysis, dynamic thermodynamic analysis, tensile bending test, comprehensive analysis of electrical properties, degradation recycling and self-repairing test to assess their applicability in the field of electrical engineering.
The following conclusions can be drawn from the experimental analysis: (1) The Van-0.25 system has the best heat resistance, mechanical properties, and electrical properties, but exhibits poor degradation recycling performance and low self-healing efficiency due to the low content of imine bonding, and the Van-1 all-bio-based resin has a less comprehensive performance than traditional epoxy resins, but meets the in-service requirements of electrical materials, and exhibits a better self-healing (2) With the increase of EDV content, the curing rate of the resin system is accelerated, and the samples are fully cured and crosslinked, showing excellent solvent resistance, as verified by infrared spectroscopy and gelation rate tests. It was demonstrated that the glass transition temperature, mechanical strength of the polymers were related to the cross-linking density and the rigidity of the chain segment structure, in which Van-0.25 had the highest glass transition temperature and mechanical strength, and also showed excellent thermal stability, and the introduction of the bio-based resins played a certain flame-retardant effect on the epoxy resin. The electrical properties decrease with the increase of imine bond content, and the dielectric properties are excellent, showing certain water resistance.3) The Vitrimer system constructed in the paper can be degraded and recycled and thermo-pressurized recycled due to the dynamic exchange of imine bonds at high temperatures, in which the chemical recycling effect is good, and the breakdown strength is maintained within a certain strength. In addition, the Vitrimer system also showed good self-healing performance, and all the specimens were repaired within 180 min.

Key words： Vitrimer epoxy resin vanillin imine bond degradation and recovery

Received: 10 April 2024

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TM215

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	Liu Yunpeng
	Li Xinyang
	Liu Hechen
	Bai Yining
	Jiang Yuzhe

Cite this article:

Liu Yunpeng,Li Xinyang,Liu Hechen等. Comprehensive Performance Study of Vanillin-Based Degradable Epoxy Resin Based on Imine Bonding[J]. Transactions of China Electrotechnical Society, 0, (): 2492934-2492934.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.240564 OR https://dgjsxb.ces-transaction.com/EN/Y0/V/I/2492934

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