双面散热功率模块的低电感多端集成电容

doi:10.19595/j.cnki.1000-6753.tces.220510

Abstract
Figure/Table
References (0)
Related Citation (15)

Download: PDF (12653 KB) HTML (1 KB)
Export: BibTeX | EndNote (RIS)

Abstract

The power density of inverters can be effectively boosted by double-sided cooling (DSC) power modules, which has become the trend for automotive motor controllers. To match the ultra-low parasitic inductance of double-sided heat sink power modules, there is an urgent need for high-performance, low- inductance integrated capacitors. However, the structure-efficiency mechanism of existing integrated capacitors needs to be clarified. The lack of fundamental models and design methodologies restricts the performance of double-sided thermal power modules. This paper analyzes in depth the field-way-mapped analysis model, low-inductance layout mechanism, and multi-ended integration design approach of integrated capacitors to overcome these issues.
First, the parasitic inductance model of the integrated capacitor is derived from the switching state of the device and the current distribution of the DC link. Secondly, a field-way-mapped model of the single-ended integrated capacitor is created using the finite element analysis (FEA) tool. Based on the current path and magnetic field distribution of the DC link, its parasitic inductance distribution law is disclosed. Thirdly, current path regulation and coupled magnetic field optimization offers the concept of multi-ended integrated capacitors, which greatly minimizes the parasitic inductance of integrated capacitors. Using actual measurement data of a double-sided heat dissipation power module with commercial integrated capacitor products as a benchmark, the feasibility and effectiveness of the basic concept and design process are validated. Finally, the fundamental concept and design methodology provided in this study are verified using real measurement results of a double-sided heat dissipation power module with a commercially available integrated capacitor product as a control group.
The simulation results demonstrate that the parasitic inductance theoretical model using the field- way-mapped analysis method has an error of less than 16 %. The experimental results show that the multi-ended integrated capacitor has lower parasitic inductance and turn-off overvoltage than the single-ended I-type integrated capacitor. The parasitic inductance is decreased by 47 %, and the turn-off overvoltage is decreased by 21 %. The integrated capacitor prototype created in this work has a reduced parasitic inductance of 32 nH for the entire device, which has excellent performance potential and design advantages over commercial integrated capacitor solutions that call for specialized packaging.
The following conclusions can be drawn from this paper: (1) The switching state of the power device is connected to the parasitic inductance of the integrated capacitor. (2) The parasitic inductance of integrated capacitors is related to the space layout of the terminal. Multi-ended integrated capacitors and strategic approaches are proposed to reduce parasitic inductance by multi-ended design. (3) Multi-ended integrated capacitors are used to achieve an optimized layout of terminals, and multiple film capacitors are connected in parallel. Accordingly, the parasitic inductance of integrated capacitors and the turn-off overvoltage of power devices can be reduced based on the phase elimination of magnetic fields and the shortening of power loops. This paper provides a new modeling strategy for low-inductance integrated capacitors and a new line of inquiry for high-power density motor controllers for automobiles.

Key words： Double-sided cooling power module low parasitic inductance multi-ended integrated capacitor optimal layout of terminal

Received: 05 April 2022

PACS:

TM464

	Service

	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	Yu Yue
	Zou Mingrui
	Zeng Zheng
	Sun Peng
	Jiang Ke

Cite this article:

Yu Yue,Zou Mingrui,Zeng Zheng等. Low-Inductance Multi-Ended Integrated Capacitor for Double-Sided Cooling Power Module[J]. Transactions of China Electrotechnical Society, 2023, 38(8): 2100-2115.

URL:

https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.220510 OR https://dgjsxb.ces-transaction.com/EN/Y2023/V38/I8/2100

[1] Wang Huai, Li Cunzhong, Zhu Guorong, et al.Model- based design and optimization of hybrid DC-link capacitor banks[J]. IEEE Transactions on Power Electronics, 2020, 35(9): 8910-8925.
[2] Semikron. Determining switching losses of Semikron IGBT modules[EB/OL]. www.semikron.com/service-support/downloads, 2022-03-31.
[3] Costinett D. Electric drive technologies for future electric vehicles[EB/OL]. web.eecs.utk.edu/~kaisun/ECE620/Fall2017/lectures, 2022-03-31.
[4] Brubaker M A, Kirbie H C, Hosking T A.Integrated DC link capacitor/bus structures to minimize external ESL contribution to voltage overshoot[C]//IEEE Transportation Electrification Conference and Expo (ITEC), Dearborn, MI, USA, 2012: 1-6.
[5] Kim N, Park C, Kwak S, et al. Experimental com- parisons and evaluations of different types of DC-link capacitor for VSI-based electric compressors in battery electric vehicle systems[J]. Energies, 2020, 9(8), 1276: 1-31.
[6] Gillot C, Schaeffer C, Massit C, et al.Double-sided cooling for high power IGBT modules using flip chip technology[J]. IEEE Transactions on Components and Packaging Technologies, 2001, 24(4): 698-704.
[7] Catalano A P, Scognamillo C, Alessandro V, et al.Numerical simulation and analytical modeling of the thermal behavior of single- and double-sided cooled power modules[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2020, 10(9): 1446-1453.
[8] 曾正, 欧开鸿, 吴义伯, 等. 车用双面散热功率模块的热-力协同设计[J]. 电工技术学报, 2020, 35(14): 3050-3064.
Zeng Zheng, Ou Kaihong, Wu Yibo, et al.Thermo- mechanical co-design of double sided cooling power module for electric vehicle application[J]. Transa- ctions of China Electrotechnical Society, 2020, 35(14): 3050-3064.
[9] Penven T, Martin C, Joubert C, et al.Optimization of metalized film capacitor connection to reduce stray inductance[J]. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9(2): 288-295.
[10] Joubert C, Rojat G, Venet P.Capacitors: revisiting a classical technology to face new challenges[C]// International Conference Automotive Power Elec- tronics, Paris, France, 2007: 1-7.
[11] Makdessi M, Sari A, Venet P.Improved model of metalized film capacitors[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2014, 21(2): 582-593.
[12] Vizuete P G, Fico F, Prieto A F, et al.Calculation of parasitic self- and mutual-inductances of thin-film capacitors for power line filters[J]. IEEE Transactions on Power Electronics, 2019, 34(1): 236-246.
[13] 刘盛福, 常垚, 李武华, 等. 压接式IGBT模块的动态特性测试平台设计及杂散参数提取[J]. 电工技术学报, 2017, 32(22): 50-57.
Liu Shengfu, Chang Yao, Li Wuhua, et al.Dynamic Switching characteristics test platform design and parasitic parameter extraction of press-pack IGBT modules[J]. Transactions of China Electrotechnical Society, 2017, 32(22): 50-57.
[14] Schnack J, Golev V, Goerdes J P, et al.Low- inductance DC-link design dedicated to SiC-based highly integrated inverters[C]//IEEE International Conference on Integrated Power Electronics Systems, Berlin, Germany, 2020: 1-7.
[15] 易荣, 赵争鸣, 袁立强. 高压大容量变换器中母排的优化设计[J]. 电工技术学报, 2008, 23(8): 94-100.
Yi Rong, Zhao Zhengming, Yuan Liqiang.Busbar optimization design for high power converters[J]. Transactions of China Electrotechnical Society, 2008, 23(8): 94-100.
[16] 耿程飞, 杨波, 吴翔, 等. 背靠背三电平变流器IGBT共叠层母线过电压耦合分析及解耦方法[J]. 电工技术学报, 2020, 35(增刊2): 440-449.
Geng Chengfei, Yang Bo, Wu Xiang, et al.Coupled over-voltage analysis and decoupling method of IGBT on the one laminated bus-bar based on back to back three-level converter[J]. Transactions of China Elec- trotechnical Society, 2020, 35(S2): 440-449.
[17] Zhang Ning, Wang Shuo, Zhao Hui.Develop parasitic inductance model for the planar busbar of an IGBT H bridge in a power inverter[J]. IEEE Transactions on Power Electronics, 2015, 30(12): 6924-6933.
[18] 刘博, 刘伟志, 董侃, 等. 基于全碳化硅功率组件的变流器母排杂散电感解析计算方法[J]. 电工技术学报, 2021, 36(10): 2105-2114.
Liu Bo, Liu Weizhi, Dong Kan, et al.Analytical calculation method for stray inductance of converter busbar based on full silicon carbide power module[J]. Transactions of China Electrotechnical Society, 2021, 36(10): 2105-2114.
[19] 金祝锋, 李威辰, 胡斯登, 等. 大容量电力电子装置中母排杂散电感提取方法的优化研究[J]. 电工技术学报, 2017, 32(14): 1-7.
Jin Zhufeng, Li Weichen, Hu Sideng, et al.Optimized stray inductance extraction method of bus bar in large-capacity power electronic equipment[J]. Transa- ctions of China Electrotechnical Society, 2017, 32(14): 1-7.
[20] Gurpinar E, Ozpineci B.Transient pulse-based impe- dance characterisation of DC-link capacitor for EV systems[J]. IET Power Electronics, 2020, 13(1): 127-132.
[21] Ando M, Wada K.Design of acceptable stray inductance based on scaling method for power electronics circuits[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2017, 5(1): 568-575.
[22] Hazra S, Madhusoodhanan S, Moghaddam G K, et al.Design considerations and performance evaluation of 1200V 100-A SiC MOSFET-based two-level voltage source converter[J]. IEEE Transactions on Industry Applications, 2016, 52(5): 4257-4268.
[23] Morya A K, Gardner M C, Anvari B, et al.Wide bandgap devices in AC electric drives: opportunities and challenges[J]. IEEE Transactions on Transport- ation Electrification, 2019, 5(1): 3-20.
[24] Mitsui K, Wada K.Design of a laminated bus bar optimizing the surge voltage, damped oscillation, and switching loss[J]. IEEE Transactions on Industry Applications, 2021, 57(3): 2737-2745.
[25] Wang Zhongjing, Wu Yuheng, Mahmud M H, et al.Busbar design and optimization for voltage overshoot mitigation of a silicon carbide high-power three-phase T-type inverter[J]. IEEE Transactions on Power Electronics, 2021, 36(1): 204-214.
[26] Lu Binxian, Pickert V, Hu Junzhu, et al.Deter- mination of stray inductance of low-inductive laminated planar multiport busbars using vector synthesis method[J]. IEEE Transactions on Industrial Electronics, 2020, 67(2): 1337-1347.
[27] Reimers J, Dorn-Gomba L, Mak C, et al.Automotive traction inverters: current status and future trends[J]. IEEE Transactions on Vehicular Technology, 2019, 68(4): 3337-3350.
[28] Brubaker M A, Hage D E, Hosking T A, et al.Integrated DC link capacitor/bus enables a 20% increase in inverter efficiency[C]//IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, 2014: 1-8.
[29] Trintis I, Franke T, Rannestad B, et al.Converter power density increase using low inductive integrated DC-link capacitor/bus[C]//IEEE International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, 2015: 1-8.
[30] 余跃, 曾正, 孙鹏, 等. 双面散热功率模块的热阻建模与测试表征研究[J]. 中国电机工程学报, 2022, 42(1): 290-302.
Yu Yue, Zeng Zheng, Sun Peng, et al.Modeling and characterizing for thermal resistance of double-sided cooling power module[J]. Proceedings of the CSEE, 2022, 42(1): 290-302.