脉冲介质阻挡放电等离子体改性对BN/EP复合材料击穿强度和热导率的影响

doi:10.19595/j.cnki.1000-6753.tces.191144

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Abstract To improve the compatibility of BN nanosheets (BNNSs) with epoxy resin (EP) matrix as well as the AC breakdown strength and thermal conductivity of BN/EP nanocomposites, BNNSs were hydroxylated by Ar+H₂O bipolar nanosecond pulse dielectric barrier discharge (DBD) low temperature plasma at atmospheric pressure and then modified by silane coupling agent KH560 in this paper. X-ray photoelectron spectroscopy (XPS) shows that the hydroxyl content of the BNNSs surface increases nearly 2 times after plasma modification. Fourier transform infrared spectroscopy (FTIR) and thermogravimetric analysis (TGA) show that plasma modification enhances the dehydration condensation reaction of BNNSs with silane coupling agent, and the coating amount of silane coupling agent on the BNNSs surface increases by 45%. The thermal stimulation depolarization current (TSDC) test shows that the plasma and silane coupling agent modified composites have more deep traps than the silane coupling agent modified composites. The breakdown test shows that the AC breakdown strength of the composites after plasma modification is improved under different filling contents. The filling content of BNNSs increases from 10% to 20% while maintaining a certain insulation strength. Meanwhile, the thermal conductivity of the composites increases by 67% as the filling content increases from 10% (silane coupling agent treated) to 20% (plasma and silane coupling agent treated).

Key words： Bipolar nanosecond pulse low temperature plasma trap characteristic breakdown strength thermal conductivity

Received: 06 September 2019

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TM215

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	Mi Yan
	Gou Jiaxi
	Liu Lulu
	Ge Xin
	Wan Hui

Cite this article:

Mi Yan,Gou Jiaxi,Liu Lulu等. Effect of Pulse Dielectric Barrier Discharge Plasma Modification on Breakdown Strength and Thermal Conductivity of BN/EP Composites[J]. Transactions of China Electrotechnical Society, 2020, 35(18): 3949-3959.

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https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.191144 OR https://dgjsxb.ces-transaction.com/EN/Y2020/V35/I18/3949

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