全浸式液汽相变冷却方式贴片电阻失效机理

doi:10.19595/j.cnki.1000-6753.tces.181635

Abstract
Figure/Table
References
Related Citation (15)

Download: PDF (22073 KB) HTML (1 KB)
Export: BibTeX | EndNote (RIS)

Abstract With the development of power electronics, switching mode power supplies (SMPSs) have already been widely used in fields of communication, energy and aerospace. High power density and high reliability are the development directions of SMPSs. Failures caused by overheating and the reliability reduction have become a bottleneck of the power density of SMPSs. The fully-immersed liquid-vapor phase change cooling technology is a new way to achieve efficient heat dissipation of SMPSs due to its high cooling efficiency and high reliability. For the fully-immersed liquid-vapor phase change cooling switching mode power supply, the cooling medium is in direct contact with the power supply device, causing the resistance of the film resistors connected to high voltage to rise or even break, which affects the stable operation of the SMPS. In this paper, through macro signal monitoring and microscopic material analysis, the external influence factors for the failures and the internal failure mechanisms of film resistors working in the cooling medium are studied, and the structure characteristics of the film resistors that can work stably in the cooling medium is also analyzed. The results can provide component selection and design guidance for the fully-immersed liquid-vapor phase change cooling switching mode power supply. It is of theoretical significance and application value for improving the reliability of fully-immersed liquid-vapor phase change cooling switching mode power supplies and completing the theoretical system of liquid-vapor phase change cooling technology applied to electrical electronic equipment.

Key words： Liquid-vapor phase change film resistor failure mechanism reliability

Received: 10 October 2018 Published: 30 December 2019

PACS:

TM54

	Service

	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	Wen Yingke
	Ruan Lin

Cite this article:

Wen Yingke,Ruan Lin. Failure Mechanism of Film Resistors under Fully-Immersed Liquid-Vapor Phase Change Cooling Technology[J]. Transactions of China Electrotechnical Society, 2019, 34(24): 5144-5150.

URL:

https://dgjsxb.ces-transaction.com/EN/10.19595/j.cnki.1000-6753.tces.181635 OR https://dgjsxb.ces-transaction.com/EN/Y2019/V34/I24/5144

[1] 顾国彪, 阮琳, 刘斐辉, 等. 蒸发冷却技术的发展、应用和展望[J]. 电工技术学报, 2015, 30(11): 1-6.
Gu Guobiao, Ruan Lin, Liu Feihui, et al.Deve- lopments, applications and prospects of evaporative cooling technology[J]. Transactions of China Elec- trotechnical Society, 2015, 30(11): 1-6.
[2] 顾国彪, 阮琳. 蒸发冷却技术在水轮发电机领域的应用和发展[J]. 中国电机工程学报, 2014, 34(29): 5112-5119.
Gu Guobiao, Ruan Lin.Applications and deve- lopments of the evaporative cooling technology in the field of hydro-generators[J]. Proceedings of the CSEE, 2014, 34(29): 5112-5119.
[3] 阮琳, 陈金秀, 顾国彪. 1 000MW水轮发电机定子空冷和蒸发冷却方式的对比分析[J]. 电工电能新技术, 2014, 33(9): 1-6.
Ruan Lin, Chen Jinxiu, Gu Guobiao.Comparison of 1 000MW hydro-generators of stator air cooling and evaporative cooling technology[J]. Advanced Tech- nology of Electrical Engineering and Energy, 2014, 33(9): 1-6.
[4] 姚涛, 侯哲, 顾国彪. 蒸发冷却技术应用于大型汽轮发电机的技术可行性[J]. 电工技术学报, 2008, 23(2): 1-5.
Yao Tao, Hou Zhe, Gu Guobiao.Application of evaporative cooling technique to large turbo generators[J]. Transactions of China Electrotechnical Society, 2008, 23(2): 1-5.
[5] 国建鸿, 顾国彪, 傅德平, 等. 330MW蒸发冷却汽轮发电机冷却技术的特点及性能[J]. 电工技术学报, 2013, 28(3): 134-139.
Guo Jianhong, Gu Guobiao, Fu Deping, et al.Cooling characteristics and performance of the 330MW evaporative cooling turbo generator[J]. Transactions of China Electrotechnical Society, 2013, 28(3): 134-139.
[6] 郭卉, 宋福川, 袁佳毅, 等. 蒸发冷却电磁除铁器的研究[J]. 中国电机工程学报, 2006, 26(11): 60-64.
Guo Hui, Song Fuchuan, Yuan Jiayi, et al.The research of the evaporative cooling electromagnetic iron-separator[J]. Proceedings of the CSEE, 2006, 26(11): 60-64.
[7] Xiong Bin, Ruan Lin, Gu Guobiao, et al. Application of evaporative cooling technology in super-high power density magnet[J]. The Review of Scientific Instruments, 2014, 85(2): 02A913.
[8] Lu Wang, Xiong Bin, Zhang Xuezhen, et al. Progress of a room temperature ECRIS using evaporative cooling technology at institute of modern physics[J]. The Review of Scientific Instruments, 2014, 85(2): 02A926.
[9] 李振国, 田新东, 张广强, 等. 电厂空冷风机变频器蒸发冷却技术改造[J]. 电力自动化设备, 2008, 28(10): 116-119.
Li Zhenguo, Tian Xindong, Zhang Guangqiang, et al.Evaporative cooling technology applied to inverter of power plant air-cooling fan[J]. Electric Power Auto- mation Equipment, 2008, 28(10): 116-119.
[10] Li Zhenguo, Ruan Lin, Liu Feihui, et al.The study of evaporative cooling technology in electric and electronic equipment[C]//IEEE International Conference on Electrical Machines and Systems, Sapporo, Japan, 2013: 1-4.
[11] 温英科, 阮琳. 全浸式蒸发冷却开关电源热分析及实验[J]. 电工技术学报, 2018, 33(18): 119-128.
Wen Yingke, Ruan Lin.Thermal analysis and experimental study of fully-immersed evaporative cooling switching mode power supply[J]. Transa- ctions of China Electrotechnical Society, 2018, 33(18): 119-128.
[12] 夏德钤, 翁贻方. 自动控制理论[M]. 北京: 机械工业出版社, 2008.
[13] 梁瑞林. 贴片式电子元件[M]. 北京: 科学出版社, 2008.
[14] 王能极. 厚膜片式电阻器硫化机理及失效预防[J]. 电子元件与材料, 2013, 32(2): 36-39.
Wang Nengji.Sulfuration mechanism and failure prevention of thick film chip resistors[J]. Electronic Components and Materials, 2013, 32(2): 36-39.
[15] 贺光辉, 邹雅冰, 李少平, 等. 贴片式电子元件典型的失效模式及机理分析[J]. 电子工艺技术, 2012(6): 341-343.
He Guanghui, Zou Yabing, Li Shaoping, et al.Typical failure mode and mechanism analysis of chip components[J]. Electronics Process Technology, 2012(6): 341-343.
[16] Reid M, Punch J, Ryan C, et al.The corrosion of electronic resistors[J]. IEEE Transactions on Com- ponents & Packaging Technologies, 2007, 30(4): 666-672.
[17] Reid M, Collins M N, Dalton E, et al.Testing method for measuring corrosion resistance of surface mount chip resistors[J]. Microelectronics Reliability, 2012, 52(7): 1420-1427.
[18] Podda S, Cassanelli G, Fantini F, et al.Failure analysis of RuO₂, thick film chip resistors[J]. Microelectronics Reliability, 2004, 44(9): 1763-1767.
[19] Huang L, Frankel G S, Abbott W H.Analysis of Ag corrosion products[J]. Journal of the Electrochemical Society, 2013, 160(8): C345-C355.
[20] Watanabe M, Shinozaki S, Toyoda E, et al.Corrosion products formed on silver after a one-month exposure to urban atmospheres[J]. Corrosion-Houston Tx-, 2006, 62(3): 243-250.
[21] Veleva L, Valdez B, Lopez G, et al.Atmospheric corrosion of electro-electronics metals in urban desert simulated indoor environment[J]. British Corrosion Journal, 2013, 43(2): 149-155.
[22] Watanabe M, Hokazono A, Handa T, et al.Corrosion of copper and silver plates by volcanic gases[J]. Corrosion Science, 2006, 48(11): 3759-3766.