尘土中可溶性盐对电路板绝缘失效的影响

Abstract
Figure/Table
References
Related Citation (3)

Download: PDF (2270 KB) HTML (1 KB)
Export: BibTeX | EndNote (RIS)

Abstract With the miniaturization of the electronic devices, the spacing of the circuit patterns on the printed circuit board (PCB) becomes smaller.So the failure of the electrochemical migration (ECM) between lines gets easier. Meanwhile, due to the severe air pollution, dust can be absorbed and deposited on the PCB. The soluble salts in the dust can change the ion concentration in the water film condensed on the PCB, so the insulation failure mechanism and the time to failure (TTF) can be changed. In this paper, the immersion silver finished Y pattern PCB is adopted to study the insulation failure characteristics and the change rule of TTF by the method of water drop (WD) tests, in which the NaCl solution and the dust solution with different concentrations are prepared. It is found that the insulation failure mechanism on the PCB changes from ECM to ion conduction and the TTF of the insulation failure shows a first decrease, then increase, and at last sharp drop trend as the ion concentration in the salt solution or the dust solution increases. There are three salt concentrations.The soluble salt concentration C_a pushes ECM of anodic metals to from quickly on PCB; the critical salt concentration C_b transfers the dendrite conduction caused by the ECM to ion conduction on PCB; and the concentration C_c restrains the ECM fully.

Key words： Insulation failure dust contamination electrochemical migration ion concentration water drop test

Received: 24 March 2015 Published: 12 July 2016

PACS:

TM207

	Service

	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors

Cite this article:

URL:

https://dgjsxb.ces-transaction.com/EN/ OR https://dgjsxb.ces-transaction.com/EN/Y2016/V31/I11/114

[1] IPC-2221A 2003,印制板通用设计标准[S].
[2] 贾京,冯士维,邓兵,等.基于热阻测量的PCB散热特性[J].电工技术学报,2014,29(9):239-244.
Jia Jing,Feng Shiwei,Deng Bing,et al.Radiating characteristics of PCB based on the thermal resistance measurement[J].Transactions of China Electrotechnical Society,2014,29(9):239-244.
[3] Kohman G T,Hermance H W,Downes G H.Silver migration in electrical insulation[J].Bell System Technical Journal,1955,34(6):1115-1147.
[4] Digiacomo G.Metal migration(Ag,Cu,Pb)in encapsulated modules and time-to-fail model as a function of the environment and package properties[C]//20^thAnnual Reliability Physics Symposium,San Diego,NV,1982:27-33.
[5] Ambat R,Jellesen M S,Minzari D,et al.Solder flux residues and electrochemical migration failures of electronic devices[C]//Proceedings of the Eurocorr,Nice,France,2009:6-10.
[6] 周怡琳,韦霞霞.尘土污染对电路板表面湿度的影响[J].电工技术学报,2015,30(23):163-168.
Zhou Yilin,Wei Xiaxia.Effects of dust contamination on surface relative humidity of printed circuit board[J].Transactions of China Electrotechnical Society,2015,30(23):163-168.
[7] Minzari D,Jellesen M S,Moller P,et al.Electrochemical migration on electronic chip resistors in chloride environments[J].IEEE Transactions on Device and Materials Reliability,2009,9(3):392-402.
[8] Jung J Y,Lee S B,Joo Y C,et al.Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaCl and Na₂SO₄ solutions[J].Microelectron Engineering,2008,85(7):1597-1602.
[9] Zhou Yilin,Yang Pan,Yuan Chengming,et al.Electrochemical migration failure of the copper trace on printed circuit board driven by immersion silver finish[J].Chemical Engineering Transactions,2013,33:559-564.
[10]张炜,成旦红,郁祖湛,等.SnAgCu钎料焊点电化学迁移的原位观察和研究[J].电子元件与材料,2007,26(6):64-68.
Zhang Wei,Cheng Danhong,Yu Zuzhan.The observation and research of SnAgCu solder joints in situ electrochemical migration[J].Electronic Components and Materials,2007,26(6):64-68.
[11]李雪清,章继高.镀金表面微孔腐蚀的电接触特点[J].电工技术学报,2004,19(9):51-56.
Li Xueqing,Zhang Jigao.Electric contact features of pore corrosion on gold-plated surface[J].Transactions of China Electrotechnical Society,2004,19(9):51-56.
[12]周怡琳.手机中电触点的失效分析[J].北京邮电大学学报,2006,29(1):69-72.
Zhou Yilin.Analysis on the electric contacts failure in mobile phones[J].Journal of Beijing University of Posts and Telecommunications,2006,29(1):69-72.
[13]Zhang Jigao.Effect of dust contamination on electrical contact failure[C]//Proceedings of the 53rd IEEE Holm Conference on Electrical Contacts,Pittsburgh,PA,2007:xxi-xxx.
[14]周怡琳,王鹏,葛世超,等.长期贮存航天电连接器尘土污染的研究[J].电工技术学报,2014,29(7):269-276.
Zhou Yilin,Wang Peng,Ge Shichao,et al.Investigation on dust contamination of aerospace electrical connectors after long-term storage[J].Transactions of China Electrotechnical Society,2014,29(7):269-276.
[15]张恺伦,江全元.基于攻击树模型的WAMS通信系统脆弱性评估[J].电力系统保护与控制,2013,41(7):116-122.
Zhang Kailun,Jiang Quanyuan.Vulnerability assessmemt on WAMS communication system based on attack tree model[J].Power System Protection and Control,2013,41(7):116-122.
[16]赵峰,梁丽,王思华.基于GO-FLOW法的高速铁路接触网系统可靠性分析[J].电工技术学报,2015,30(12):351-356.
Zhao Feng,Liang Li,Wang Sihua.A reliability evaluation of high speed railway overhead contact systems based on the GO-FLOW methodology[J].Transactions of China Electrotechnical Society,2015,30(12):351-356.
[17]IPC-9201.Surface insulation resistance handbook[S].Northbrook,IL,1990.
[18]凌丹.威布尔分布模型及其在机械可靠性中的应用研究[D].成都:电子科技大学,2011.
Ling Dan.Weibull distribution model and its application in mechanical reliability[D].Chengdu:University of Electronic Science and Technology,2011.
[19]苏傲雪,范明天,张祖平,等.配电系统元件故障率的估算方法研究[J].电力系统保护与控制,2013,41(19):61-66.
Su Aoxue,Fan Mingtian,Zhang Zuping,et al.A new approach for the evaluation of failure rates on distribution system components[J].Power System Protection and Control,2013,41(19):61-66.
[20]赵娟.污泥微波高温热解的吸附剂制备及其再利用技术研究[D].哈尔滨:哈尔滨工业大学,2007.
[21]黄超群,许良军,王东,等.尘土存在条件下连接器电接触可靠性研究[J].电工电气,2010(2):1-4.
Huang Chaoqun,Xu Liangjun,Wang Dong,et al.Failure probability research of electric contact in dusty environment[J].Electrotechnics Electric,2010(2):1-4.