Abstract As a significant part of the future energy landscape, reliability of wind turbine is vital. Power electronic converters are widely used in high power wind turbines. The reliability of the wind power converters is becoming an issue deserved more attention, due to the complex environment and special operation of wind turbines. This paper presents a review of the aging-to-failure mechanisms of power electronic converters in the context of wind turbine application, as well as states the impacts of incessant thermal cycling associated with low frequency operation on the generator side and the random wind turbulence. Condition monitoring methods of wind power converters are analyzed for improving the reliability and availability of wind turbines. The development trends are also discussed.
Li Hui,Liu Shengquan,Ran Li等. Overview of Condition Monitoring Technologies of Power Converter for High Power Grid-Connected Wind Turbine Generator System[J]. Transactions of China Electrotechnical Society, 2016, 31(8): 1-10.
[1] 黄玲玲, 曹家麟, 符杨. 海上风电场电气系统现状分析[J]. 电力系统保护与控制, 2014, 42(10): 147-154. Huang Lingling, Cao Jialin, Fu Yang. Review of electrical systems for offshore wind farms[J]. Power System Protection and Control, 2014, 42(10): 147- 154. [2] Besnard F, Fischer K, Tjernberg L B. A model for the optimization of the maintenance support organi- zation for offshore wind farms[J]. IEEE Transactions on Sustainable Energy, 2013, 4(2): 443-450. [3] Spinato F, Tavner P J, Van Bussel G J W, et al. Reliability of wind turbine subassemblies[J]. IET Renewable Power Generation, 2010, 3(4): 387-401. [4] Wilkinson M. Reliability data field study in the reliawind project[R]. Wind Turbine Reliability Work- shop Albuquerque, NM USA, 2009. [5] Berg H, Wolfgang E. Advanced IGBT modules for railway traction applications: reliability testing[J]. Microelectronics Reliability, 1998, 38(6): 1319-1323. [6] 魏克新, 杜明星. 基于集总参数法的IGBT模块温度预测模型[J]. 电工技术学报, 2011, 26(12): 79-84. Wei Kexin, Du Mingxing. Temperature prediction model of IGBT modules based on lumped parameters method[J]. Transactions of China Electrotechnical Society, 2011, 26(12): 79-84. [7] Polikarpova M, Roytta P, Alexandrova J, et al. Thermal design and analysis of a direct-water cooled direct drive permanent magnet synchronous generator for high-power wind turbine application[C]//Inter- national Conference on Electrical Machines (ICEM), Marseille, 2012: 1488-1495. [8] Senturk O S, Helle L, Munk-Nielsen S, et al. Converter structure-based power loss and static thermal modeling of the press-pack IGBT three-level ANPC VSC applied to multi-MW wind turbines[J]. IEEE Transactions on Industry Applications, 2011, 47(6): 2505-2515. [9] 杨旭. 基于饱和压降测量的IGBT功率模块状态评估方法研究[D]. 重庆: 重庆大学, 2012. [10] Oh H, Han B, McCluskey P, et al. Physics-of-failure: condition monitoring and prognostics of insulated gate bipolar transistor modules: a review[J]. IEEE Transactions on Power Electronics, 2015, 30(5): 2413-2426. [11] Musallam M, Johnson C M, Yin Chunyan, et al. Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications[C]// IEEE Energy Conversion Congress and Exposition, Atlanta, GA, 2010: 970-977. [12] Huang H and Mawby P A. A lifetime estimation technique for voltage source inverters[J]. IEEE Transactions on Power Electronics, 2013, 25(8): 4113-4119. [13] Smet V, Forest F, Huselstein J J, et al. Ageing and failure modes of IGBT modules in high temperature power cycling[J]. IEEE Transactions on Industrial Electronics, 2011, 58(1): 191-200. [14] Pittini R, D'Arco S, Hernes M, et al. Thermal stress analysis of IGBT modules in VSCs for PMSG in large offshore wind energy conversion systems[C]// Proceedings of the 14th European Conference on Power Electronics and Applications (EPE 2011), Birmingham, 2011: 1-10. [15] McMillan D, Ault G W. Specification of reliability benchmarks for offshore wind farms[C]//Proceedings of ESREL Conference, Valencia, Spain, 2008: 2601-2606. [16] Malcolm Sharples B P. Regulatory issues on safety and structural assurance of offshore wind farms on the OCS [C]//Offshore Technology Conference, Texas, USA, 2011: 2-5. [17] Yang S, Xiang D, Bryant A, et al. Condition monitoring for device reliability in power electronic converters: a review[J]. IEEE Transactions on Power Electronics, 2010, 25(11): 2734-2752. [18] 郑利兵, 韩立, 刘钧, 等. 基于三维热电耦合有限元模型的IGBT失效形式温度特性研究[J]. 电工技术学报, 2011, 26(7): 242-246. Zheng Libin, Han li, Liu Jun, et al. Investigation of the temperature character of igbt failure mode based on 3D thermal-electro coupling FEM[J]. Transactions of China Electrotechnical Society, 2011, 26(7): 242-246. [19] Semikron. Technical explanations of IGBT modules[M]. 2007. [20] Sujod M Z, Erlick I, Engelhardt S. Improving the reactive power capability of the DFIG-based wind turbine during operation around the synchronous speed[J]. IEEE Transactions on Energy Conversion, 2013, 28(3): 736-745. [21] Held M, Jacob P, Nicoletti G, et al. Fast power cycling test of IGBT modules in traction appli- cation[C]//International Conference on Power Elec- tronics and Drive Systems, Itzehoe, Germany, 1999, 1: 425-430. [22] Bruns M, Rabelo B, Hofmann W. Investigation of doubly fed induction generator drives behavior at synchronous operating point in wind turbines[C]//In Proceedings of 13th European Conference on Power Electronics and Applications (EPE), Barcelona, Spain, 2009: 1-10. [23] Zhou D, Blaabjerg F, Lau M, et al. Thermal analysis of multi-MW two level wind power converter[C]// IECON 2012—38th Annual Conference on IEEE Industrial Electronics Society, Montreal, QC, 2012: 5858-5864. [24] Jones R, Waite P. Optimised power converter for multi-MW direct drive permanent magnet wind turbines[C]//Proceedings of the 2011—14th European Conference on Power Electronics and Applications (EPE 2011), Keele, UK, 2011: 1-10. [25] Morroni J, Dolgov A, Shiazi M, et al. Online health monitoring in digitally controlled power converters[C]// Proceedings of IEEE Power Electronics Specialists Conference, Orlando, USA, 2007: 112-118. [26] Rodriguez M, Claudio A, Theilliol D. A new fault detection technique for IGBT based on gate voltage monitoring[C]//Proceedings of IEEE Power Elec- tronics Specialists Conference, Orlando, USA, 2007: 1001-1005. [27] Farokhzad B. Method for early failure recognition in power semiconductor modules: US, 6145107[P]. 2000-11-07. [28] Bryant A, Yang S, Mawby P A, et al. Investigation into IGBT d V /d t during turn-off and its temperature dependence[J]. IEEE Transactions on Power Elec- tronics, 2011, 26(10): 3019-3031. [29] Musallam M, Johnson C M, Yin C, et al. Real-time comparison of power module failure modes under in-service conditions[C]//Proceedings of 13th European Conference on Power Electronics and Applications (EPE), Barcelona, Spain, 2009: 1-10. [30] Xiang D, Ran L, Tavner P J, et al. Monitoring solder fatigue in a power module using case-above-ambient temperature rise[J]. IEEE Transactions on Industry Applications, 2011, 47(6): 2578-2591. [31] Hameed Z, Hong Y S, Cho Y M, et al. Condition monitoring and fault detection of wind turbines and related algorithms: a review[J]. Renewable and Sustainable Energy Reviews, 2009, 13(1): 1-39. [32] Xiang D, Ran L, Tavner P J, et al. Condition monitoring power module solder fatigue using inverter harmonic identification[J]. IEEE Transactions on Power Electronics, 2012, 27(1): 235-247. [33] 刘建涛, 王治华, 王珂. 不同结构电压源换流器损耗对比分析[J]. 电力系统保护与控制, 2013, 41(6): 105-110. Liu Jiantao, Wang Zhihua, Wang Ke. Comparative analysis of losses of voltage source converters with different structures[J]. Power System Protection and Control, 2013, 41(6): 105-110. [34] 景巍, 谭国俊, 叶宗彬. 大功率三电平变频器损耗计算及散热分析[J]. 电工技术学报, 2011, 26(2): 134-140. Jing Wei, Tan Guojun, Ye Zongbin. Losses calcu- lation and heat dissipation analysis of high-power three-level converters[J]. Transactions of China Electrotechnical Society, 2011, 26(2): 134-140. [35] Patil N, Das D, Goebel K, et al. Identification of failure precursor parameters for insulated gate bipolar transistors(IGBTs)[C]//International Conference on Prognostics and Health Management, Denver, USA, 2008: 1-5. [36] Yang L, Agyakwa P A, Johnson C M. A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects[J]. Microelectronics Reliabi- lity, 2011, 51(9): 1882-1886.
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