尘土污染对电路板表面湿度的影响

Abstract
Figure/Table
References
Related Citation (5)

Download: PDF (2317 KB) HTML (1 KB)
Export: BibTeX | EndNote (RIS)

Abstract In this paper,to study the effect of soluble and insoluble particles of typical dust on the relative humidity on PCB surface,the comb pattern PCB covered by particles is adopted as test samples under temperature humidity bias (THB) conditions.The surface insulation resistance between circuits on PCB is monitored.The effect of compositions and solubility of soluble particles on the critical relative humidity is investigated.The reasons of the insoluble particles,under the action of capillary,changing the desorption of water from PCB surface and keeping high humidity on PCB surface for longer time are researched.The electrochemical migration mechanism of PCB caused by dust contamination is also discussed.

Key words： Dust particles printed circuit board solubility of slats critical relative humidity temperature humidity bias experiment

Received: 31 March 2015 Published: 18 December 2015

PACS:

TM207

	Service

	E-mail this article
	Add to my bookshelf
	Add to citation manager
	E-mail Alert
	RSS
	Articles by authors
	Zhou Yilin
	Wei Xiaxia

Cite this article:

Zhou Yilin,Wei Xiaxia. Effects of Dust Contamination on Surface Relative Humidity of Printed Circuit Board[J]. Transactions of China Electrotechnical Society, 2015, 30(23): 163-168.

URL:

https://dgjsxb.ces-transaction.com/EN/ OR https://dgjsxb.ces-transaction.com/EN/Y2015/V30/I23/163

[1] Prasad Ray P.Surface Mount Technology,Principles and Practice[M].New York:Van Nostrand Reinhold,1989:1-12.
[2] 田民波.电子封装工程[M].1版.北京:清华大学出版社,2003.
[3] 周怡琳,Michael Pecht.浸银电路板蔓延腐蚀评估方法[J].电工技术学报,2011,26(2):44-49.
Zhou Yilin,Michael Pecht.Assessment methodology of creep corrosion on circuit boards immersed with silver[J].Transactions of China Electrotechnical Society,2011,26(2):44-49.
[4] Sheng Zhan,Azarian M H,Pecht M.Reliability of printed circuit boards processed using no-clean flux technology in temperature-humidity-bias conditions[J].IEEE Transactions on Device and Materials Reliability,2008,8(2):426-434.
[5] Burnett W H,Sandroff F S,D’Edigo S M.Circuit failure due to fine mode particulate air pollution[C].The 18th International Symposium for Testing and Failure Analysis,Los Angeles,California,USA,1992:329-333.
[6] 贾京,冯士维,邓兵,等.基于热阻测量的PCB散热特性[J].电工技术学报,2014,29(9):239-244.
Jia Jing,Feng Shiwei,Deng Bing,et al.The radiating characteristics of PCB based on the thermal resistance measurement[J].Transactions of China Electrotechnical Society,2014,29(9):239-244.
[7] Brox B,Tegehall P E.Reliability of electronics in harsh environments[J].Soldering & Surface Mount Technology,1995,7(3):13-16.
[8] 周怡琳,王鹏,葛世超,等.长期贮存航天电连接器尘土污染的研究[J].电工技术学报,2014,29(7):269-276.
Zhou Yilin,Wang Peng,Ge Shichao,et al.Investigation on dust contamination of aerospace electrical connectors after long-term storage[J].Transactions of China Electrotechnical Society,2014,29(7):269-276.
[9] Liang Y N,Zhang J G,Liu J J.Identification of inorganic compounds in dust collected in Beijing and their effects on electric contacts[C].Proceedings of the Forty-Third IEEE Holm Conference on Electrical Contacts,Philadelphia,PA,USA,1997:315-327.
[10]周怡琳.手机中电触点的失效分析[J].北京邮电大学学报,2006,29(1):69-72.
Zhou Yilin.Analysis of the failure electrical contacts in phone’s internal part[J].Journal of Beijing University of Posts and Telecommunications,2006,29(1):69-72.
[11]Lv Yang,Xu Liangjun.Stress analysis of dust particle on the electrical contact surface[C].2011 IEEE 57th Holm Conference on Electrical Contacts(Holm),Minneapolis,MN,2011:290-297.
[12]Lin Xueyan,Zhang Jigao.Dust corrosion[C].Proceedings of the 50th IEEE Holm Conference on Electrical Contacts and the 22nd International Conference on Electrical Contacts,Seattle,WA,USA,2004:255-262.
[13]张恺伦,江全元.基于攻击树模型的 WAMS 通信系统脆弱性评估[J].电力系统保护与控制,2013,41(7):116-122.
Zhang Kailun,Jiang Quanyuan.Vulnerability assessment on WAMS communication system based on attack tree model[J].Power System Protection and Control,2013,41(7):116-122.
[14]王鹏程.刀闸辅助触点状态出错对母差保护的影响[J].电力系统保护与控制,2010,38(5):124-126.
Wang Pengcheng.Discussion on the Influences of disconnector auxiliary contact status error on bus differential protection[J].Power System Protection and Control,2010,38(5):124-126.
[15]叶建光.交流接触器不宜作异步电动机缺相保护元件[J].电力系统保护与控制,2009,37(19):141-142.
Ye Jianguang.Using AC connector for motor’s phase break protection is improper[J].Power System Protection and Control,2009,37(19):14l-142.
[16]Wan J W,Gao J C,Lin X Y,et al.Water-soluble salts in dust and their effects on electric contact surfaces[C].Proceedings of the International Conference on Electrical Contacts,Electromechanical Components and Their Applications,Nagoya,Japan,1999:37-42.
[17]Zhang J G,Liang Y N,Wan J W,et al.Analysis of organic compounds in airborne dust collected in Beijing[C].Proceedings of the Forty-Fourth IEEE Holm Conference on Electrical Contacts,Arlington,VA,USA,1998:166-171.
[18]Sandroff F S,Burnett W H.Reliability qualification test for circuit boards exposed to airborne hygroscopic dust[C].42nd Electronic Components and Technology Conference,San Diego,CA,USA,1992:384-389.
[19]Song B,Azarian M H,Pecht M G.Effect of temperature and relative humidity on the impedance degradation of dust-contaminated electronics[J].Journal of the Electrochemical Society,2013,160(3):C97-C105.
[20]Zhou Yilin,Yang Pan,Yuan Chengming,et al.Electrochemical migration failure of the copper trace on printed circuit board driven by immersion silver finish[J].Chemical Engineering Transaction,2013,33:559-564.
[21]IPC-TM-650 2.6.14.1∶2 000,Electrochemical migration resistance test[S].
[22]刘光启,马连湘,刘杰.化学化工物性数据手册(无机卷)[M].北京:化学工业出版社,2003.
[23]Watanabe T,Saito K,Seo K.Study of error propagation due to dust for thin-cover coat disk systems[C].International Symposium on Optical Memory and Optical Data Storage Topical Meeting,Hawaii,USA,2002:126-128.
[24]IPC J-STD-004B-2011,Requirements for Soldering Fluxes[S].
[25]IPC Publication IPC-9201,Surface Insulation Resistance Handbook[S].