功率器件散热特性的非稳态测量方法

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Abstract The heat dissipation system of power electronic device is analyzed based upon a lumped method. The temperature-changing rules during unsteady-state heat conduction are deduced and therefore a method is proposed for charactering system heat dissipation properties by measurement of temperature-changing curves during unsteady-state heat conduction process. Taking the power module as an example, the temperature increasing and decreasing processes are experimentally measured under different conditions. The measurement results agree well with the theoretical prediction, indicating that such a method can be effectively applied in practical engineering applications. The proposed method can not only avoid the complicated computations, but also provide a convenient way for obtaining the heat dissipation properties of power electronic devices and predicting the maximum temperature rise. It is especially applicable to those application cases that the heat dissipation structures are complicated and the heat boundary conditions are difficult to be confirmed.

Key words： Heat dissipation property power electronic devices unsteady-state heat conduction thermal resistance measurement

Received: 13 November 2010 Published: 19 March 2014

PACS:

TN606

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	Articles by authors
	Li Hongcai
	Chen Feifan
	Dong Yonggui

Cite this article:

Li Hongcai,Chen Feifan,Dong Yonggui. An Unsteady-State Measurement Method for Charactering Heat Dissipation Properties of Power Electronic Devices[J]. Transactions of China Electrotechnical Society, 2012, 27(2): 114-120.

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http://dgjsxb.ces-transaction.com/EN/ OR http://dgjsxb.ces-transaction.com/EN/Y2012/V27/I2/114

[1] Xie X L, He Y L, Tao W Q, et al. An experimental investigation on a novel high-performance integrated heat pipe-heat sink for high-flux chip cooling[J]. Applied Thermal Engineering, 2008, 28: 433-439.
[2] Sauciuc I, Chrysler G, Mahajan R, et al. Spreading in the heat sink base: phase change systems or solid metals[J]. IEEE Transactions on Components and Packaging Technologies, 2002, 25(4): 621-628.
[3] Xiong D X, Azar K, Tavassoli B. High capacity, compact hybrid air cooling system[C]. Thermal and Thermomechanical Phenomena in Electronics Systems-Proceedings of the Intersociety Conference, 2006: 786-790.
[4] 金雍, 羊彦, 等. 功率半导体器件温度状态的实时预测技术[J]. 电工技术学报, 2001, 16(5): 68-72.
[5] Etemoglu A B. A brief survey and economical analysis of air cooling for electronic equipments[J]. International Communications in Heat and Mass Transfer, 2007, 34: 103-113.
[6] Salem T E, Ibitayo D, Geil B R. Validation of infrared camera thermal measurements on high-voltage power electronic components[J]. IEEE Transactions on Instrument and Measurement, 2007, 56 (5): 1973-1978.
[7] 胡建辉, 李锦庚, 邹继斌等. 变频器中的IGBT模块损耗计算及散热系统设计[J]. 电工技术学报, 2009, 24(3): 159-163.
[8] Ozturk E, Tari I. Forced air cooling of CPUs with heat sinks: a numerical study[J]. IEEE Transaction on Components and Packging Technologies, 2008, 31(3): 650-660.
[9] Malinarič S. Uncertainty analysis of thermophysical property measurements of solids using dynamic methods[J]. International Journal of Thermophysics, 2007, 28(1): 20-32.
[10] Štofanikl V, Markovič M, Boháč V, et al. RT-Lab the equipment for measuring thermophysical properties by transient methods[J]. Measurement Science Review, 2007, 7(3): 15-18.
[11] Filicori F, Rinaldi P, Vannini G, et al. A new technique for thermal resistance measurement in power electron devices[J]. IEEE Transactions on Instrumentation and Measurement, 2005, 54(5): 1921-1925.