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| Transient Thermal Analysis of Sealed Electromechanical Relay in Repeated Short-Term Operation System |
| Liang Panwang, Li Zhenbiao, He Zhengjie, Liu Yun |
| Huazhong University of Science and Technology Wuhan 430074 China |
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Abstract In order to better understand the temperature distribution of sealed electromechanical relay and its influence factors, a new modeling“space-filling-model”is introduced in this paper. The model can use one meshing model to simulate both close and open status through modifying the parameters of the filling material. Using software ANSYS, the paper simulates the transient temperature field of sealed electromechanical relay in the repeated short-term system. According to the calculation, the distribution of transient temperature field and its influence factors are summarized. Besides, the paper gives the relationship between the main heat source inside the relay and the current level. Finally, the paper puts forward an optimization method to decrease the temperature rise of the relay.
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Received: 20 February 2010
Published: 07 March 2014
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2011, Vol. 26 
