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| Reliability Analysis of Power Device Based on the Case Temperatures |
| Cui Man1, Hu Zhen2,3, Zhang Tengfei2, Zhou Yan2, Jia Rong4, Liu Junjie5 |
1. School of Information and Electronics Beijing Institute of Technology Beijing 100081 China;
2. College of Automation & College of Artificial Intelligence Nanjing University of Posts and Telecommunications Nanjing 210042 China;
3. Suzhou Di'ao Elevator Co. Suzhou 215200 China;
4. College of Electrical & Information Hubei University of Automotive Technology Shiyan 442002 China;
5. College of Computer Science Changchun University of Science and Technology Changchun 130022 China |
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Abstract As the channel of heat transfers from the inside of the power device to the outside, the solder layer is vulnerable toaging and falling off due to the effect of temperature fluctuations. The heat cannot be dissipated quickly and accumulates in the chip, causing the chip to overheat and damage. As a result, the power device may fail suddenly. Real-time evaluation of solder aging is a vital guarantee for the operational reliability of power devices. The thermal impedance from the chip to the baseplate is a signal to characterize solder aging, and the measurement of junction temperature for estimating the thermal impedance is costly. From an economic point of view, this paper proposes a novel solder aging evaluation method based on the case temperatures. The case temperature distribution is sensitive to the solder aging. From this perspective, a two-dimensional temperature gradient monitoring algorithm based on case temperatures was modeled to describe the changes in case temperature distribution due to the solder aging. In addition, the relationship between the changes in case temperature distribution and thermal impedance was studied. With solder aging degree as the intermediate variable, the evolution of case temperature distribution and thermal impedance was recorded through an offline accelerated aging test. A database including information on two-dimensional temperature gradients and thermal impedance was built. In practical applications, the case temperature is measured by a thermistor sensor placed between the baseplate and the heatsink. Then the two-dimensional temperature gradient value is calculated. Based on the database, the thermal impedance value is identified to evaluate the reliability of the device. Finite-element simulation and experiment verify the effectiveness of the proposed method. The finite-element simulation results show that the heat transfer region of the chip becomes narrower due to the solder aging. When the aging region reaches 2.5 mm, the heat transfer area of the solder layer decreases by nearly 40%, and the change in the heat transfer area causes the temperature at the center of the baseplate to increase continuously. When the aging area reaches 2.5 mm, the two-dimensional temperature gradient ?TP,x and ?TP,y increases by about 10.3% and 15.4%, respectively, and the thermal impedance ZJC increases by about 15.2%.The experimental results showed that ?TP,x, ?TP,y, and ZJC increased by 16.1%, 20%, and 20.1% at the end of the accelerated aging test. The verification results show that the solder aging leads to a change in the temperature distribution of the baseplate, which leads to a change in the two-dimensional temperature gradient. As a result, the two-dimensional temperature gradient and thermal impedance are consistent with the solder aging. Compared with the existing methods, this method can realize the reliability evaluation of the device only with the case temperature, has a better economy, and gives some guidance for engineering applications.
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Received: 19 May 2022
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2023, Vol. 38 
