Transactions of China Electrotechnical Society  2022, Vol. 37 Issue (3): 786-792    DOI: 10.19595/j.cnki.1000-6753.tces.210049
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Study on Composite Dielectric Encapsulation Materials for High Voltage Power Device Packaging
Li Junjie1, Mei Yunhui2, Liang Yu1, Tang Xinling3, Lu Guoquan4
1. School of Materials Science and Engineering Tianjin University Tianjin 300350 China;
2. School of Electrical Engineering Tiangong University Tianjin 300387 China;
3. State Key Laboratory of Advanced Power Transmission Technology Global Energy Interconnection Research Institute Co. Ltd Beijing 102209 China;
4. Bradley Department of Electrical and Computer Engineering Virginia Tech University AV Blacksburj 24061 USA

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