[1] 张冬海, 张晖, 张忠, 等. 纳米技术在高性能电力复合绝缘材料中的工程应用[J]. 中国科学: 化学, 2013, 43(6): 725-743. Zhang Donghai, Zhang Hui, Zhang Zhong, et al. Industry applications of nanotechnology in high performance insulation composites[J]. Scientia Sinica Chimica, 2013, 43(6): 725-743.
[2] 鲁杨飞, 李庆民, 刘涛, 等. 高频电压下表面电荷分布对沿面放电发展过程的影响[J].电工技术学报, 2018, 33(13): 3059-3070.Lu Yangfei, Li Qingmin, Liu Tao, et al. Effect of surface charge on the surface discharge evolution for polyimide under high frequency voltage[J]. Transa- ctions of China Electrotechnical Society, 2018, 33(13): 3059-3070.
[3] 王健, 李伯涛, 李庆民, 等. 直流GIL中线形金属微粒对柱式绝缘子表面电荷积聚的影响[J]. 电工技术学报, 2016, 31(15): 213-222.Wang Jian, Li Botao, Li Qingmin, et al. Impact of linear metal particle on surface charge accumulation of post insulator within DC GIL[J]. Transactions of China Electrotechnical Society, 2016, 31(15): 213-222.
[4] Volpov E K.Dielectric strength coordination and generalized spacer design rules for HVAC/DC SF6 gas insulated systems[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2004, 11(6): 949-963.
[5] 贾志杰, 张斌, 范建斌, 等. 直流气体绝缘金属封闭输电线路中绝缘子的表面电荷积聚研究[J]. 中国电机工程学报, 2010, 30(4): 112-117.Jia Zhijie, Zhang Bin, Fan Jianbin, et al. Study of charge accumulation along the insulator surface in the DC GIL[J]. Proceedings of the CSEE, 2010, 30(4): 112-117.
[6] 唐炬, 潘成, 王邸博, 等. 高压直流绝缘材料表面电荷积聚研究进展[J]. 电工技术学报, 2017, 32(8): 10-21.Tang Ju, Pan Cheng, Wang Dibo, et al. Development of studies about surface charge accumulation on insulating material under HVDC[J]. Transactions of China Electrotechnical Society, 2017, 32(8): 10-21.
[7] 汤浩, 吴广守, 范建斌, 等. 直流气体绝缘输电线路的绝缘设计[J]. 电网技术, 2008, 32(6): 65-70.Tang Hao, Wu Guangning, Fan Jianbin, et al. Insulation design of gas insulated HVDC trans- mission line[J]. Power System Technology, 2008, 32(6): 65-70.
[8] 吕程, 廖瑞金, 吴伟强, 等. 纳米TiO2对油纸绝缘介质直流空间电荷特性的影响[J]. 高电压技术, 2015, 41(2): 417-423.Lü Cheng, Liao Ruijin, Wu Weiqiang, et al. Influence of nano-TiO2 on DC space charge characteristics of oil-paper insulation material[J]. High Voltage Engineering, 2015, 41(2): 417-423.
[9] 刘志民, 邱毓昌, 冯允平. 对绝缘子表面电荷积聚机理的讨论[J]. 电工技术学报, 1999, 14(2): 65-68.Liu Zhimin, Qiu Yuchang, Feng Yunping. The discussion about accumulation mechanism of surface charge on insulating spacer[J]. Transactions of China Electrotechnical Society, 1999, 14(2): 65-68.
[10] Straumann U, Schüller M, Franck C M.Theoretical investigation of HVDC disc space charging in SF6 gas insulated systems[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2012, 19(6): 2196-2205.
[11] Gremaud R, Molitor F, Doiron C, et al.Solid insulation in DC gas-insulated systems[R]. Paris, France: CIGRE, 2014.
[12] Imai T, Sawa F, Nakano T, et al.Effects of nano-and micro-filler mixture on electrical insulation properties of epoxy based composites[J]. IEEE Transactions on Dielectrics and Electrical Insulation, 2006, 13(2): 319-326.
[13] 杜伯学, 侯兆豪, 徐航, 等. 高压直流电缆绝缘用聚丙烯及其纳米复合材料的研究进展[J]. 高电压技术, 2017, 43(9): 2769-2780.Du Boxue, Hou Zhaohao, Xu Hang, et al. Research achievements in polypropylene and polypropylene/ inorganic nanocomposites for HVDC cable insu- lation[J]. High Voltage Engineering, 2017, 43(9): 2769-2780.
[14] 杜伯学, 孔晓晓, 肖萌, 等. 高导热聚合物基复合材料研究进展[J]. 电工技术学报, 2018, 33(14): 3149-3159.Du Boxue, Kong Xiaoxiao, Xiao Meng, et al. Advances in thermal performance of polymer-based composites[J]. Transactions of China Electro- technical Society, 2018, 33(14): 3149-3159.
[15] Kinloch A J, Mohammed R D, Taylor A C, et al.The effect of silica nano particles and rubber particles on the toughness of multiphase thermosetting epoxy polymers[J]. Journal of Materials Science, 2005, 40(18): 5083-5086.
[16] Blackman B R K, Kinloch A J, Lee J S, et al. The fracture and fatigue behaviour of nano-modified epoxy polymers[J]. Journal of Materials Science, 2007, 42(16): 7049-7051.
[17] Tsai J L, Hsiao H, Cheng Y L.Investigating mechanical behaviors of silica nanoparticle reinforced composites[J]. Journal of Composite Materials, 2010, 44(4): 505-524.
[18] 李庆民, 黄旭炜, 刘涛, 等. 分子模拟技术在高电压绝缘领域的应用进展[J]. 电工技术学报, 2016, 31(12): 1-13.Li Qingmin, Huang Xuwei, Liu Tao, et al. Application progresses of molecular simulation methodology in the area of high voltage insulation[J]. Transactions of China Electrotechnical Society, 2016, 31(12): 1-13.
[19] 张晓星, 陈霄宇, 肖淞, 等. 改性SiO2增强环氧树脂热力学性能的分子动力学模拟[J]. 高电压技术, 2018, 44(3): 740-749.Zhang Xiaoxing, Chen Xiaoyu, Xiao Song, et al. Molecular dynamics simulation of thermal-mechanical properties of modified SiO2 reinforced epoxy resin[J]. High Voltage Engineering, 2018, 44(3): 740-749.
[20] 刘利珍, 谢庆, 梁少栋, 等. 分子数对交联环氧树脂体系特性影响的分子动力学模拟[J]. 高压电器, 2018(5): 80-86.Liu Lizhen, Xie Qing, Liang Shaohe, et al. Molecular dynamics simulation of the influence of molecular number on the properties of cross-linked epoxy resin system[J]. High Voltage Apparatus, 2018(5): 80-86.
[21] 张世良, 戚力, 高伟, 等. 分子模拟中常用的结构分析与表征方法综述[J]. 燕山大学学报, 2015, 39(3): 213-220.Zhang Shiliang, Qi Li, Gao Wei, et al. Summary of methods for structural analysis and characterization in molecular modeling[J]. Journal of Yanshan University, 2015, 39(3): 213-220.
[22] Sun H, Jin Z, Yang C, et al.COMPASS II: extended coverage for polymer and drug-like molecule databases[J]. Journal of molecular modeling, 2016, 22(2): 47.
[23] Wu C, Xu W.Atomistic molecular modelling of crosslinked epoxy resin[J]. Polymer, 2006, 47(16): 6004-6009.
[24] Plimpton S.Fast parallel algorithms for short-range molecular dynamics[J]. Journal of Computational Physics, 1995, 117(1): 1-19.
[25] Jiang D, Van Duin A C T, Goddard III W A, et al. Simulating the initial stage of phenolic resin carbonization via the ReaxFF reactive force field[J]. The Journal of Physical Chemistry A, 2009, 113(25): 6891-6894.
[26] Neumann M.Dipole moment fluctuation formulas in computer simulations of polar systems[J]. Molecular Physics, 1983, 50(4): 841-858.
[27] Lide D R, David R.CRC Handbook of Chemistry and Physics[M]. Boca Raton, FL: CRC Press 2760pp, 1990.
[28] Jund P, Jullien R.Molecular-dynamics calculation of the thermal conductivity of vitreous silica[J]. Physical Review B, 1999, 59(21): 13707.
[29] Müller-Plathe F.A simple nonequilibrium molecular dynamics method for calculating the thermal conductivity[J]. The Journal of Chemical Physics, 1997, 106(14): 6082-6085.
[30] Green M S.Markoff random processes and the statistical mechanics of time-dependent phenomena. II. Irreversible processes in fluids[J]. The Journal of Chemical Physics, 1954, 22(3): 398-413.
[31] Kubo R.Statistical-mechanical theory of irreversible processes. I. General theory and simple applications to magnetic and conduction problems[J]. Journal of the Physical Society of Japan, 1957, 12(6): 570-586.
[32] Fan Z, Pereira L F C, Wang H Q, et al. Force and heat current formulas for many-body potentials in molecular dynamics simulations with applications to thermal conductivity calculations[J]. Physical Review B, 2015, 92(9): 094301.
[33] Hoover W G.Computational statistical mechanics[M]. Elsevier, 2012.
[34] Giang T, Park J, Cho I, et al.Effect of backbone moiety in epoxies on thermal conductivity of epoxy/alumina composite[J]. Polymer Composites, 2013, 34(4): 468-476.
[35] Qiao G, Lasfargues M, Alexiadis A, et al.Simulation and experimental study of the specific heat capacity of molten salt based nanofluids[J]. Applied Thermal Engineering, 2017, 111: 1517-1522.
[36] Fan Z, Hirvonen P, Pereira L F C, et al. Bimodal grain-size scaling of thermal transport in polycrystalline graphene from large-scale molecular dynamics simulations[J]. Nano letters, 2017, 17(10): 5919-5924.
[37] 郭亚林, 梁国正, 丘哲明, 等. 碳纤维/有机硅改性环氧树脂复合材料性能研究[J]. 材料工程, 2004, 9: 42-44.Guo Yalin, Liang Guozheng, Qiu Zheming, et al. Properties of carbon fiber/silicone modified epoxy composite[J]. Journal of Materials Engineering, 2004(9): 42-44.
[38] 吴超富. 交联环氧树脂的分子模拟研究[D]. 长沙: 湖南大学, 2007.
[39] 郝留成, 杨保利, 田浩, 等. 特高压盆式绝缘子工艺技术研究[J]. 绝缘材料, 2014, 47(5): 45-49.Hao Liucheng, Yang Baoli, Tian Hao, et al. Study of process technology of UHV basin insulator[J]. Insulating Materials, 2014, 47(5): 45-49.
[40] Li C, Strachan A.Molecular dynamics predictions of thermal and mechanical properties of thermoset polymer EPON862/DETDA[J]. Polymer, 2011, 52(13): 2920-2928.
[41] Williams M L, Landel R F, Ferry J D.The tem- perature dependence of relaxation mechanisms in amorphous polymers and other glass-forming liquids[J]. Journal of the American Chemical society, 1955, 77(14): 3701-3707. |