Thermal Field Characteristics of High Voltage Film Capacitors in Thermal Stability Test
Wang Zijian1,Yan Fei2,Hou Zhijian1,Wang Chonghu3,Xu Zhiniu1
1.Hebei Provincial Key Laboratory of Power Transmission Equipment Security DefenseNorth China Electric Power University Baoding 071003 China; 2.China Electric Power Research Institute Beijing 100192 China; 3.Shanghai Siyuan Electric Power Capacitor Co.Ltd Shanghai 201108 China
Abstract To obtain the temperature distributions on the shell and in the core of high voltage film capacitors in the thermal stability test,a thermal field model for high voltage film capacitors is formulated in Fluent 15.0 and solved based on the finite volume method.The results reveal that the side surface is higher than other surfaces on the shell and the hottest spot on the capacitor shell is located on the side surface.The hottest spot in the entire capacitor is located on the central axis of the capacitor close to the tail part.The temperature distributions on the capacitor shell are non-uniform.Because of complexity of capacitor structure,the temperature does not always increase/decrease monotonically.And there are several local hot spots.A fiber grating capacitor temperature monitoring system and an infrared thermal imager are used to measure the temperatures of some key points on the shell and in the interior of a high voltage film capacitor respectively in the thermal stability test.The measured results are qualitatively and quantitatively consistent with the simulated results.
Wang Zijian,Yan Fei,Hou Zhijian等. Thermal Field Characteristics of High Voltage Film Capacitors in Thermal Stability Test[J]. Transactions of China Electrotechnical Society, 2016, 31(17): 207-216.
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2016, Vol. 31 
