基于热阻测量的PCB散热特性

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Abstract This article presents a quick approach to measure the thermal resistance of PCB in vacuum based on the relationship of temperature and Schottky junction voltage drop. Once the steady heating curve of SiC diode is obtained, the temperature characteristic of small current is applied to determine the thermal resistance of PCB. The transfer heat performance of PCB at different coverage Cu and different thermal via diameter is studied. The results show that the thermal resistance of PCB is found to decrease with the increasing coverage Cu. Thermal via placed on the PCB is significant to reduce the thermal resistance of PCB under constant coverage Cu. And the thermal resistance of PCB reduces with the increasing thermal via diameter. The finite element ANSYS software simulates the PCB temperature. The PCB temperature is consistent with the experimental results.

Key words： PCB thermal via thermal resistance ANSYS simulation heat dissipation

Received: 13 September 2013 Published: 05 November 2014

PACS:

TK124

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	Articles by authors
	Jia Jing
	Feng Shiwei
	Deng Bing
	Meng Qinghui
	Zhang Yamin

Cite this article:

Jia Jing,Feng Shiwei,Deng Bing等. Transfer Heat Performance of PCB Based on Thermal Resistance Measurement[J]. Transactions of China Electrotechnical Society, 2014, 29(9): 239-244.

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http://dgjsxb.ces-transaction.com/EN/ OR http://dgjsxb.ces-transaction.com/EN/Y2014/V29/I9/239

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