Bi对AgSnO<sub>2</sub>触头材料接触电阻的影响

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Abstract AgSnO₂ is the most likely contact material to replace of AgCdO contact material. But AgSnO₂ exists defect of high contact resistance in the process of use. How to reduce the contact resistance of AgSnO₂ is the key issues in the paper. Firstly, AgSnO₂ and AgSnO₂Bi₂O₃ contact materials are prepared by powder metallurgy. Arc tests are carried on the two kinds of contact materials. The structure and shape on arc-melted surface of AgSnO₂Bi₂O₃ and AgSnO₂ are observed and analyzed by scanning electron microscopy. Then, by wetting test, the wetting angle of AgSnO₂Bi₂O₃ and AgSnO₂ are measured. The results show that the wettability of liquid Ag on the SnO₂ is improved by adding Bi elements. And the wetting angle decreased. So, river-like tissue formed on the surface of AgSnO₂Bi₂O₃ after arc erosion. The SnO₂ is avoided concentration to forms insulating layer on contact surface. Finally, it is verified that the AgSnO₂Bi₂O₃ contact resistance is smaller than that of AgSnO₂ by electrical property tests. Through the tests, it is proved that the AgSnO₂ contact resistance is reduced by adding Bi.

Key words： AgSnO2 wettability AgSnO2Bi2O3 contact resistance

Received: 14 October 2013 Published: 05 November 2014

PACS:	TM501
	TG668

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	Wang Haitao
	Wang Jingqin
	Zhu Yancai

Cite this article:

Wang Haitao,Wang Jingqin,Zhu Yancai. Influence of Bi to AgSnO₂ Material’s Contact Resistance[J]. Transactions of China Electrotechnical Society, 2014, 29(5): 265-270.

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http://dgjsxb.ces-transaction.com/EN/ OR http://dgjsxb.ces-transaction.com/EN/Y2014/V29/I5/265

[1] Ye Qibin, Wang Yaping. Redistribution of SnO 2 particles in Ag/SnO 2 materials during rapid solid fication[J]. Materials Science & Engineering: A, 2007, 449-451: 1045-1048.
[2] Liu X M, Wu S L, Chu Paul K, et al. Effects of coating process on the characteristics of Ag-SnO 2 contact materials[J]. Materials Chemistry & Physics. 2006, 98 ( 2/3): 477-480.
[3] 陈宏燕, 谢明, 王锦. 银氧化锡电触头材料研究现状及发展趋势[J]. 贵金属, 2011, 32(2): 77-81. Chen Hongyan, Xie Ming, Wang Jin. The advances and developmental trend of Ag/SnO 2 electrical contact material[J]. Precious Metals, 2011, 32(2): 77-81.
[4] Huy Xue S, Wang H, et al. Effects of rare earth element Nd on the solder ability and microstructure of Sn-Zn lead-free solder[J]. J. Mater. Sci. , 2011, 22(5): 481-487.
[5] 王景芹, 朱艳彩, 王海涛, 等. 添加物Bi对AgSnO 2 触头材料的影响[J]. 电工技术学报, 2011, 26(1): 29-32. Wang Jingqin, Zhu Yancai, Wang Haitao, et al. Impact of additives Bi on AgSnO 2 contact material[J]. Transactions of China Electrotechnical Society, 2011, 26(1): 29-32.
[6] Wang Jingqin, Wang Haitao, Ming Wen, et al. Testing results analysis of contact materials’ electrical contact performance[J]. Journal of Zhejiang University Science A, 2007, 3: 459-463.
[7] 任龙霞, 吴为麟. 虚拟仪器在低压电弧故障断路器研制中的应用[J]. 电力系统保护与控制, 2011, 39(5): 134-138, 143. Ren Longxia, Wu Weilin. Application of Labview in the development of arc fault circuit interrupters（AFCI）[J]. Power System Protection and Control, 2011, 39(5): 134-138, 143.
[8] Liu X M, Wu S L, Paul K. Effects of coating process on the characteristics of AgSnO 2 contact materials[J]. Materials Chemistry and Physics, 2006: 477-480.
[9] 李靖, 黄锡文, 叶凡. 低压交流阻性负载条件下AgSnO 2 触头材料抗电弧侵蚀性能研究[J]. 电工材料, 2011(4): 3-9. Li Jing, Huang Xiwen, Ye Fan. Researches on arc erosion resistance properties of AgSnO 2 contact materials under low voltage AC and resistive load[J]. Electrical Materials, 2011(4): 3-9.
[10] 付翀, 姜凤阳, 王俊勃. La掺杂对AgSnO 2 电接触合金阴极侵蚀区成分的影响[J], 电工技术学报, 2010, 25(5): 44-47, 53. Fu Chong, Jiang Fengyang, Wang Junbo. Effect of La doping on arc erosion products of nanocomposite AgSnO 2 contact alloys[J]. Transactions of China Electrotechnical Society, 2010, 25(5): 44-47, 53.
[11] Chen Xiaohua, Jia Chengchang, Liu Xiangbing. Applications of powder metallurgy technology to manufacture of silver based contact materials[J]. Powder Metallurgy Industry, 2009, 19(4): 41-46.
[12] 李靖, 马志瀛, 李建明. 50Hz和400Hz下Ag基合金电触头材料的电弧侵蚀[J]. 电工技术学报, 2010, 25(8): 1-5. Li Jing, Ma Zhiying, Li Jianming. Arc erosion of silver-based alloy electrical contact materials at 50Hz and 400Hz[J]. Transactions of China Electrotechnical Society, 2010, 25(8): 1-5.
[13] Park Jung Hwa, Wasilewski Christine E, Almodovar Noelia, et al. The responses to surface wettability gradients induced by chitosan nanofilms on microtex- tured titanium mediated by specific integrin receptors [J]. Biomaterials, 2012, 33 (30): 7386-7393.
[14] Shokri N. Drying patterns of porous media containing wettability contrasts[J]. Journal of Colloid & Interface Science, 2013, 391: 135-141.
[15] Vivet L, Joudrier A L, Bouttemy M, et al. Wettability and XPS analyses of nickel-phosphorus surfaces after plasma treatment: an efficient approach for surface qualification in mechatronic processes[J]. Applied Surface Science, 2013, 274: 71-78.
[16] Jin Gyu Kim, Ilbeom Choi, Dai Gil Lee. Contact angle and wettability of hybrid surface-treated metal adherends[J]. Journal of Adhesion Science & Technology, 2013, 27(7): 794-810.