电工技术学报  2019, Vol. 34 Issue (zk2): 518-527    DOI: 10.19595/j.cnki.1000-6753.tces.L80261
电力电子 |
多芯并联封装IGBT缺陷与失效先导判据
黄先进, 凌超, 孙湖, 游小杰
北京交通大学电气工程学院 北京 100044
The Leading Criterion for Defects and Failures in Multi-Chip Parallel Package IGBTs
Huang Xianjin, Ling Chao, Sun Hu, You Xiaojie
School of Electrical Engineering Beijing Jiaotong University Beijing 100044 China